The Journal Editorial Committee wishes to take up timely subjects related to earthquake engineering such as technical issues that cut across various fields, leading-edge technical issues, etc. in the special editions. We wish to aggressively utilize the characteristics of electronic journals that provide the required academic journal papers at any time and any place. For the special edition, we would like to invite submission of technical papers and technical reports related to specific themes through organized sessions (OS) at the Annual Conventions, symposia, and through our members, and publish them as the Journal of JAEE. We would therefore invite you to actively submit your manuscripts for the special editions.
Please submit the special edition proposal by E-mail to the Journal Chief Editor.
Please include the following items.
Journal of JAEE submit@journal.jaee.gr.jp
The technical papers/technical reports submission method will follow the Submission Rules for the JAEE Journal. At that time, we will ask the Special Edition Chief Editor to request submission of technical papers/technical reports to the expected participants. In case of open invitation to the public, the Special Edition Chief Editor will invite submission of journal papers for the special edition through the JAEE NEWS and the homepage.
The technical papers/technical reports editing method will follow the Editing Rules for the JAEE Journal. At that time, the specific editing work will be done through close communication between the Special Edition Chief Editor and participating committee members.
The technical papers/technical reports peer review method will follow the Peer Review Rules for the JAEE Journal. As a general rule, the participating committee members will select the reviewers, but requests (up to two reviewers per edition) from the Special Edition Chief Editor will be taken into consideration when making the selection.
For details, please refer to the homepage noted below.
http://www.jaee.gr.jp/english/contribution/con02.html
The special edition will be published as soon as the technical papers/technical reports are ready.
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